Equipement

TEL Lithius track 300mm
The TEL CLEAN TRACK LITHIUS is a 300/200mm coater/developer. In response to drastically fluctuating market needs, the CLEAN TRACK LITHIUS was developed based on three concepts: improved processing, short cycle times, and enhanced network solutions. It achieves increased responsiveness and stability for important process technologies, shorter lead and start-up times, and allows for easier modifications.

TEL Lithius Track 300mm
The TEL CLEAN TRACK LITHIUS is a 300/200mm coater/developer. In response to drastically fluctuating market needs, the CLEAN TRACK LITHIUS was developed based on three concepts: improved processing, short cycle times, and enhanced network solutions. It achieves increased responsiveness and stability for important process technologies, shorter lead and start-up times, and allows for easier modifications.

Tokyo Electron Trias High K CVD
CVD System, 12” <45nm process Vintage 20102 Chambers: CVD & ALD Process: NiOx, HfOx
Trias cluster: 2 LoadportsLM: Front end Main power distribution (MPD) Transfer module, TM
EX reactor, PM2:Plasma capability: No Includes:Ozonizer & H20 Box2 Touch screens ozonizer
High-k CVD reactor PM4:Thermal based depositionTransformer box (Hi-K) option elec box:

DAINIPPON SCREEN SU-3000
Condition “As is”
Manufacturer: DNS
Tool model: SU-3000 Aquaspin Serial number: 63530-3608
Date of manufacture: June 2004
Configuration:
12" Wafer cleaning system
4 AQUASPIN Chambers
Spin 1 SRM
Spin 2 MPC Bevel
Spin 3 MPC
Spin 4 MPC JDP
Factory interface 2 FOUP's
Complete system including all delivery systems
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AMAT AKT 1600
Condition: "as is"
Tool Serial Number : 6C102
Vintage 2005
Process:
PECVD iN,SiO2, i-a-Si,SiON and N+ a-Si
Software Version: AKT7.3
System Power Rating: 208 VAC 3-Phase
Flat panel size: 320 x 352 mm
(5) Process chambers:
Film Capability
SiN,
SiO2,
i-a-Si,
SiON,
N+ a-Si (Remote Plasma Clean)
SiN,
Includes: Chillers

AMAT Oasis clean
Condition “As is”
Manufacturer:
Applied
Materials
Type:
300mm Oasis clean
Serial number:
414522
Date of manufacture:
2006
Software revision:
OA_B3.0_38
Configuration:
ChA Axiom (Dry strip)ChB Tempest (Wet etch, NH4OH, H2O2, HF) ChD Tempest (Wet etch, NH4OH, H2O2, HF)
Modules:
MainframeFI (Yaskawa robot)Bulkfill Chemical cabinetRotary vacuum pump (for ChA)Main AC boxGenerator rack
Connection details:
208V 3fase 50/60Hz 240A
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Axcelis Fusion ES3 Asher
System Axcelis ES3 Asher
Vintage Feb-2001300mm optional 200mm
Incl chiller, pumps, gasboxes decomissioned in working conditioning, in production till April 2022
System comes incl following spare parts.
Spare chamber module,All quarts parts used for 1 chamber Main ComputerMicrowave 3 pieces Lampcontrollers etc.Lamps approx. 75 pieces TouchscreenSMC foreline valveThrottle valve
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BTU PV 614
Vintage 2013
Heater type IR Lamp
Belt Width 36 cmConveyor Speed cm/min 56-560 15, 38Load station 38 cm
Unload station 38 cm
Number of heated zones 6
Maximum Temprature rating 1000°C
Operation Temprature range 200-900°C
Forced Air Cooling Length 229 cm Atmosphere, CDA , Typicle (scfh, m3/hr)
900, 25.2
Process Exhaust, Venturi Assist 2
Electrical 400/230 VAC 112 AMP 81 KVA 50/60 Hz
Overall Length 576 cm
Overall Width 96,5 cm
Overall Height 184 cm

LAM 490
LAM 490 AutoEtcher
•
Polysilicon: 490
•
Wafer size: 6 inch
•
Upgraded TFT monitors
•
Incl maintenance console
•
Conditon: AS IS (No Chiller, No pump but with ENI RF Generator)
Features:
•
Single-wafer processing
•
Fully automated microprocessor control
•
Cassette-to-cassette wafer processing
•
Vacuum load locked
•
Programmable, variable electrode spacing
•
Endpoint detection
•
Configurable for 3-inch to 6-inch wafers
•
Stand-alone or bulk-head mount configuration

FSI POLARIS 3500

LAM 490
LAM 490 AutoEtcher
•
Polysilicon: 490
•
Wafer size: 6 inch
•
Upgraded TFT monitors
•
Wafer detection
•
Incl maintenance console
•
Conditon: AS IS (No Chiller, No pump but with ENI RF Generator)
Features:
•
Single-wafer processing
•
Fully automated microprocessor control
•
Cassette-to-cassette wafer processing
•
Vacuum load locked
•
Programmable, variable electrode spacing
•
Endpoint detection
•
Configurable for 3-inch to 6-inch wafers
•
Stand-alone or bulk-head mount configuration

LAM 490
LAM 490 AutoEtcher
•
Polysilicon: 490
•
Wafer size: 6 inch
•
Upgraded TFT monitors
•
Wafer detection
•
Incl maintenance console
•
Conditon: AS IS (No Chiller, No pump but with ENI RF Generator)
Features:
•
Single-wafer processing
•
Fully automated microprocessor control
•
Cassette-to-cassette wafer processing
•
Vacuum load locked
•
Programmable, variable electrode spacing
•
Endpoint detection
•
Configurable for 3-inch to 6-inch wafers
•
Stand-alone or bulk-head mount configuration

SSEC / Veeco ML 330
Single wafer cleaning system , 8" Vintage 2005
WaferStorm Wet Processing Platform
The WaferStorm platform is the industry choice for a number of critical solvent-based processes in the advanced packaging, MEMs, RF, Data Storage and Photonics markets. The ML 3300 system is well suited for R&D and pilot environments.

TEL Tactras RLSA Etch Chamber
TactrasTM RLSATM provides an innovative, new plasma technology that TEL has been optimizing for years. Microwave technology provides high selectivity and excellent etch- profile control with low electron temperature of the radical-rich process by diffusion plasma. In addition, the output microwave stability, high repeatability, and process operation range has been improved with microwave broadband technology which enables precise control of the radical/ion ratio for high profile controllability. TactrasTM RLSATM has a high market share for a critical application in leading-edge logic devices.
RLSA Chamber information :ESC for wafer with Dual He CoolingNihon Koshuha Microwave Generator / Model is MKS 050B04C-OSC-V
Turbo Pump:SHIMADZU / Model is FT2301D Generator Details:
Top MKS-050B04 PS-V Bottom Daihen RGA-20C
Gas Box Configuration :
1 N2 5 NF3
2 TSA 6 SiH4
3 Ar
4 H2

Akrion Goldfinger Velocity
Single wafer cleaning system , 12" Vintage 2007
Defectivity Improvement
The
Velocity
single wafer product line is focused on improving defectivity. This includes removal of particle and residue contamination from the wafer frontside, backside and edge.Defects are removed without physical damage to sensitive structures and without film etching. This is accomplished using advanced physical clean technologies – Goldfinger Megasonics, Jetstream Nano and Backside Megasonics. Watermark-free performance is available with Sahara dry. The Velocity is available in 4 or 6 chamber versions, each with stacked chambers to minimize footprint. The technology and platform are used for particle removal (post deposition, sensitive structures, backside and post post CMP) and post etch/ash (FEOL and BEOL) applications.
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Jordan Valley BedeMetrix-L
Jordan Valley BedeMetrix-L
X-ray Metrology system , 4" up to 12"
Manufacturer: Jordan Valley / Bede
Type: BedeMetrix-L
Date of manufacture: Aug 2006
Versatile, multi-configuration X-ray metrology tool
For semiconductor research and process development Complete metrology for advanced processes on a single tool Seamless integration to the BedeMetrix
-F,
The ideal bridge tool between development and pilot production
Multiple application versatility
•
combine XRD, HRXRD and XRR techniques
•
optimisedcharacterisationofmultipleapplications
•
100μm and blanket wafer measurement
•
open cassette loading from 100mm to 300mm
•
ideal for process development
Versatile, multi-configuration X-ray metrology tool
For semiconductor research and process development Complete metrology for advanced processes on a single tool Seamless integration to the BedeMetrix
-F,
The ideal bridge tool between development and pilot production
Multiple application versatility
•
combine XRD, HRXRD and XRR techniques
•
optimisedcharacterisationofmultipleapplications
•
100μm and blanket wafer measurement
•
open cassette loading from 100mm to 300mm
•
ideal for process development

Fogale Nanotech DEEPROBE
Manufacturer:
Fogale Nanotech
Type:
300mm DEEPROBE 300-M
Date of manufacture:
2014
Configuration:
Technology
Low Conherence IR interferometry for step high measurement
Applications
High A/R TSV depth measurement for 200 and 300mm wafer (Via first & Middle)
Benefits
Non destructieve Technology
Fast and easy to use
CCD camera for spot positioning and pattern recognition
Adjustable Metrology spot size
TSV diameter > 2um A:R up to 30 Calibration and maintenance free
Technology
Low Conherence IR interferometry for step high measurement
Applications
High A/R TSV depth measurement for 200 and 300mm wafer (Via first & Middle)
Benefits
Non destructieve Technology
Fast and easy to use
CCD camera for spot positioning and pattern recognition
Adjustable Metrology spot size
TSV diameter > 2um A:R up to 30 Calibration and maintenance free

Rudolph Sonus 7800
Manufacturer:
Rudolph Technologies
Type:
300mm Sonus 7800
Date of manufacture:
2015
Configuration:
Rudolph Technologies has
introduced
the
SONUS Technology
for
measuring
thick
films
and
film stacks
used
in
copper pillar bumps
and
for
detecting
defects,
such
as
voids
, in
through
silicon
vias
(
TSVs
).
Copper
pillar
bumps
are a
critical
component of
many
advanced
packaging
technologies
and
TSVs
provide
a means
for
signals
to
pass
through
multiple
vertically
stacked
chips in
three
dimensional
integrated
circuits (
3DIC
). The SONUS Technology is non-contact
and
non-
destructive
,
and
is
designed
to
provide
faster
,
less
costly
measurements
and
greater
sensitivity
to
smaller defects
than
existing
alternatives
such
as X-
ray
tomography
and
acoustic
microscopy
.
Rudolph Technologies has introduced the SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids , in through silicon vias ( TSVs ). Copper pillar bumps are a critical component of many advanced packaging technologies and TSVs provide a means for signals to pass through multiple vertically stacked chips in three dimensional integrated circuits ( 3DIC ). The SONUS Technology is non-contact and non- destructive , and is designed to provide faster , less costly measurements and greater sensitivity to smaller defects than existing alternatives such as X- ray tomography and acoustic microscopy .