News

30 NEWS ITEMS FOUND
 
24-04-2012 Toshiba to relocate Thai operations to new semiconductor facility
Toshiba has announced it will build a new production facility to relocate its semiconductor operations and redress the problems caused by the 2011 floods and to meet future growth demands. The plant, which will... Read more >
17-04-2012 Carlos Lee appointed new director general of EPIC
The European Photonics Industry Consortium (EPIC) has announced that Carlos Lee will become its new director general with immediate effect. The announcement, made at the association’s recent annual genera... Read more >
12-04-2012 ‘Velocity’ the new buzzword in Intel’s PQS annual awards
The usual suppliers that include the major sector players and host of Japanese firms dominated Intel’s Preferred Quality Supplier (PQS) award system in 2011. However, the word ‘velocity’ has... Read more >
10-04-2012 Centrotherm subsidiary joins Sematech’s FEP to research low-temperature processing techniques
Sematech has announced that the centrotherm photovoltaics AG subsidiary, centrotherm thermal solutions, will join its Front End Program (FEP) to develop low-temperature processing techniques for use in high-per... Read more >
03-04-2012 Spansion and SK Hynix announce NAND partnership
Spansion and SK Hynix have announced that they will work together to deliver Spansion SLC NAND products at the 4x, 3x, and 2x nodes to the embedded market. The alliance, which will make its first Spansion SLC N... Read more >
28-03-2012 Tokyo Stock Exchange delists bankrupt Elpida
Elpida Memory has had its stock removed from the Tokyo stock market after filing for bankruptcy protection on February 27th 2011. Elpida began trading shares on the Tokyo Stock Exchange in November 2004 but has... Read more >
28-03-2012 Tool Order: Himax Technologies places repeat order for EV Group’s IQ Aligner system
Himax Technologies, a leading producer of CMOS image sensors, semiconductor devices and power management devices, has placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EV G... Read more >
27-03-2012 Tool Order: Camtek tapped for US$3.5 million worth of Falcon wafer inspection tools
Camtek, the automated and technological solution provider, has announced that it has booked orders exceeding US$3.5 million for its Falcon family of automated wafer inspection products. The order was from an... Read more >
27-03-2012 Intel consolidates its lead as the world’s top chipmaker
Industry market monitor IHS iSuppli has confirmed that American multinational chipmaker Intel has extended its lead in the semiconductor industry after a successful 2011. The announcement follows the company&rs... Read more >
23-03-2012 February book-to-bill passes parity as equipment orders reach US$1.33 billion
The recovery in equipment sales continued for the fourth consecutive month with North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders in February 2012. The SEMI book-to-b... Read more >
21-03-2012 Gigaphoton opens new US regional headquarters in Beaverton, Oregon
Gigaphoton, the high-performance DUV laser light provider is to move its business management, logistical and training centres to its US headquarters in Oregon. It is hoped that the decision will mean better ser... Read more >
20-03-2012 Management reshuffle at NXP Semiconductors’ CFO
Karl-Henrik Sundström, vice president and CFO of Dutch-based NXP Semiconductors, has stepped down from his position for personal reasons, effective July 2012. Read more >
08-03-2012 TSMC places blockbuster purchase order with ASML
Confirming the recent demonstration of annoyance by Applied Materials, Mike Splinter that spending on lithography equipment was eating into his company’s sales opportunities; TSMC has placed its largest... Read more >
06-03-2012 Tokyo Electron pays Oerlikon US$275 million for PV thin film operations
Oerlikon Group’s loss-making Oerlikon Solar, the originator of the turnkey thin-film business model with a-Si and tandem-junction thin-film technology, is being sold to Tokyo Electron (TEL) for US$275 mi... Read more >
05-03-2012 Independence Day for Globalfoundries
Globalfoundries said that it has agreed terms with AMD to acquire the remaining stake the fables firm had in the company, three-years after spinning-off its IC manufacturing operations. Read more >
28-02-2012 SEMI acquires Plastic Electronics Conference and Exhibition
The Plastics Electronics Conference, co-located with SEMICON Europa since 2010, has been acquired by trade group, SEMI. The conference the organizing committee, which included industry and academic leaders in... Read more >
27-02-2012 Exit Elpida
Citing a DRAM glut, weak pricing and a strong Yen currency, Elpida Memory has filed for bankruptcy protection in an effort to restructure the company. A ‘sponsor’ is being sort, though it was clea... Read more >
24-02-2012 Tool Order: Applied Materials and Novellus rewarded with further purchases from TSMC
TSMC has placed further orders with Applied Materials and Novellus Systems. Ending the week with two separate batches of orders valued at US$72.43 million was Applied Materials, while Novellus received a pur... Read more >
24-02-2012 SEMI book-to-bill continues 4-month rise
Boosted by foundry and logic IC manufacturers spending habits over the winter months, the SEMI book-to-bill ratio continued a 4-month recovery in January with a 0.95 ratio. North America-based semiconductor... Read more >
21-02-2012 SUSS MicroTec and GenISys team on mask aligner optimization
In a bid to enable easier modelling of large numbers of different source shapes, SUSS MicroTec and GenISys are teaming to jointly offer their products for mask aligner equipment. The cooperation means that Gen... Read more >
20-02-2012 Applied Materials expects wafer fab equipment spending above US$30 billion
Despite overcapacity in key markets such as DRAM, wafer fab equipment spending is projected to be above US$30 billion in 2012, according to Applied Materials. Mike Splinter said in a conference call to discus... Read more >
20-02-2012 TSMC keeps spending on facilities and front-end fab equipment
Leading semiconductor foundry, TSMC has placed official orders valued at over US$300 million in the last 4-weeks, bringing the total in 2012 to approximately US$600 million. According to Applied Materials chai... Read more >
13-02-2012 SPIE 2012: Gigaphoton hits 7 watts of EUV power with production LPP light source
Gigaphoton is contining its development program to achieve an output of 250W for its laser-produced plasma (LPP) light source, while confirming that its laser-produced plasma (LPP) light source, scheduled to... Read more >
13-02-2012 SPIE 2012: Imec touts ‘Directed Self-Assembly’ process to support 193nm and EUV lithography
Perennial push-outs of EUV lithography and continued reliance on 193nm immersion technology have opened the way for technologies to supplement inherent challenges for both. Not only is E-beam lithography gain... Read more >
08-02-2012 Order Focus: Singulus receives two orders for Timaris vacuum deposition system
Singulus Technologies has won two new orders for its Timaris deposition coating machine from an unnamed source. The company expects this to be the start of a good year for shipments of such tools, as nano-coati... Read more >
08-02-2012 Order Focus: Veeco ships TurboDisc MOCVD tool to LG Siltron
Veeco Instruments has revealed that it has received an order for one of its TurboDisc MOCVD tools from South Korean epi wafer manufacturer, LG Siltron. The TurboDisc tool is a K465i gallium nitride MOCVD system... Read more >
07-02-2012 Silicon wafer revenues climb as shipments fall
Unlike the PV industry that has seen wafer prices decline by as much as 70% in 2011, semiconductor silicon wafer revenue actually increased by 2%, while shipments decreased 3%. Though SEMI Silicon Manufacture... Read more >
07-02-2012 Gigaphoton’s GT63A next-gen ArF excimer laser ready for shipment in Q2’12
Gigaphoton has added to its immersion lithography product range with the GT63A, a next-generation ArF excimer laser for multi-patterning immersion lithography scanners. The company has announced that the new pr... Read more >
07-02-2012 Rudolph ships first MetaPULSE system for under-bump metallization processes
Process characterization equipment supplier Rudolph Technologies has entered the back-end packaging sector of the semiconductor industry with its first shipment of its MetaPULSE metrology system. The shipment t... Read more >
06-02-2012 Steve Appleton killed in plane crash
Friday, February 3rd, Micron Technology issued a short statement announcing Chairman and CEO, Steve Appleton had been killed in a light aircraft crash near Boise, Idaho. Mr Appleton was married with chidren... Read more >