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24-04-2012
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Toshiba to relocate Thai operations to new semiconductor facility
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Toshiba has announced it will build a new production facility to relocate its semiconductor operations and redress the problems caused by the 2011 floods and to meet future growth demands. The plant, which will...
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17-04-2012
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Carlos Lee appointed new director general of EPIC
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The European Photonics Industry Consortium
(EPIC) has announced that Carlos Lee will become its new director general with
immediate effect. The announcement, made at the association’s recent annual
genera...
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12-04-2012
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‘Velocity’ the new buzzword in Intel’s PQS annual awards
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The usual suppliers that include the major sector players and host of
Japanese firms dominated Intel’s Preferred Quality Supplier (PQS) award
system in 2011. However, the word ‘velocity’ has...
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10-04-2012
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Centrotherm subsidiary joins Sematech’s FEP to research low-temperature processing techniques
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Sematech has announced that the centrotherm photovoltaics AG
subsidiary, centrotherm thermal solutions, will join its Front End Program
(FEP) to develop low-temperature processing techniques for use in
high-per...
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03-04-2012
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Spansion and SK Hynix announce NAND partnership
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Spansion and SK Hynix have announced that they will work
together to deliver Spansion SLC NAND products at the 4x, 3x, and 2x nodes to
the embedded market. The alliance, which will make its first Spansion SLC N...
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28-03-2012
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Tokyo Stock Exchange delists bankrupt Elpida
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Elpida Memory has had its stock removed from the Tokyo stock market after filing for bankruptcy protection on February 27th 2011. Elpida began trading shares on the Tokyo Stock Exchange in November 2004 but has...
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28-03-2012
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Tool Order: Himax Technologies places repeat order for EV Group’s IQ Aligner system
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Himax Technologies, a leading producer of CMOS image
sensors, semiconductor devices and power management devices, has placed a
repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from
EV G...
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27-03-2012
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Tool Order: Camtek tapped for US$3.5 million worth of Falcon wafer inspection tools
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Camtek, the automated and technological solution provider, has announced
that it has booked orders exceeding US$3.5 million for its Falcon
family of automated wafer inspection products. The order was from an...
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27-03-2012
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Intel consolidates its lead as the world’s top chipmaker
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Industry market monitor IHS iSuppli has confirmed that American
multinational chipmaker Intel has extended its lead in the semiconductor
industry after a successful 2011. The announcement follows the company&rs...
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23-03-2012
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February book-to-bill passes parity as equipment orders reach US$1.33 billion
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The recovery in equipment sales continued for the fourth consecutive
month with North America-based manufacturers of semiconductor equipment
posted $1.33 billion in orders in February 2012. The SEMI book-to-b...
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21-03-2012
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Gigaphoton opens new US regional headquarters in Beaverton, Oregon
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Gigaphoton, the high-performance DUV laser light provider is to move its business management, logistical and training centres to its US headquarters in Oregon. It is hoped that the decision will mean better ser...
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20-03-2012
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Management reshuffle at NXP Semiconductors’ CFO
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Karl-Henrik Sundström, vice president and CFO of Dutch-based NXP
Semiconductors, has stepped down from his position for personal reasons,
effective July 2012.
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08-03-2012
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TSMC places blockbuster purchase order with ASML
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Confirming the recent demonstration of annoyance by Applied Materials,
Mike Splinter that spending on lithography equipment was eating into his
company’s sales opportunities; TSMC has placed its largest...
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06-03-2012
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Tokyo Electron pays Oerlikon US$275 million for PV thin film operations
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Oerlikon Group’s loss-making Oerlikon Solar, the originator of the
turnkey thin-film business model with a-Si and tandem-junction thin-film
technology, is being sold to Tokyo Electron (TEL) for US$275 mi...
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05-03-2012
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Independence Day for Globalfoundries
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Globalfoundries said that it has agreed terms with AMD to acquire the
remaining stake the fables firm had in the company, three-years after
spinning-off its IC manufacturing operations.
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28-02-2012
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SEMI acquires Plastic Electronics Conference and Exhibition
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The Plastics Electronics Conference, co-located with SEMICON Europa
since 2010, has been acquired by trade group, SEMI. The conference the
organizing committee, which included industry and academic leaders in...
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27-02-2012
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Exit Elpida
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Citing a DRAM glut, weak pricing and a strong Yen currency, Elpida
Memory has filed for bankruptcy protection in an effort to restructure
the company. A ‘sponsor’ is being sort, though it was clea...
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24-02-2012
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Tool Order: Applied Materials and Novellus rewarded with further purchases from TSMC
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TSMC has placed further orders with Applied Materials and Novellus
Systems. Ending the week with two separate batches of orders valued at
US$72.43 million was Applied Materials, while Novellus received a
pur...
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24-02-2012
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SEMI book-to-bill continues 4-month rise
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Boosted by foundry and logic IC manufacturers spending habits over the
winter months, the SEMI book-to-bill ratio continued a 4-month recovery
in January with a 0.95 ratio. North America-based semiconductor...
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21-02-2012
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SUSS MicroTec and GenISys team on mask aligner optimization
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In a bid to enable easier modelling of large numbers of different source
shapes, SUSS MicroTec and GenISys are teaming to jointly offer their
products for mask aligner equipment. The cooperation means that Gen...
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20-02-2012
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Applied Materials expects wafer fab equipment spending above US$30 billion
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Despite overcapacity in key markets such as DRAM, wafer fab equipment
spending is projected to be above US$30 billion in 2012, according to
Applied Materials. Mike Splinter said in a conference call to discus...
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20-02-2012
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TSMC keeps spending on facilities and front-end fab equipment
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Leading semiconductor foundry, TSMC has placed official orders valued at
over US$300 million in the last 4-weeks, bringing the total in 2012 to
approximately US$600 million. According to Applied Materials chai...
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13-02-2012
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SPIE 2012: Gigaphoton hits 7 watts of EUV power with production LPP light source
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Gigaphoton is contining its development program to achieve an output of
250W for its laser-produced plasma (LPP) light source, while confirming
that its laser-produced plasma (LPP) light source, scheduled to...
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13-02-2012
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SPIE 2012: Imec touts ‘Directed Self-Assembly’ process to support 193nm and EUV lithography
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Perennial push-outs of EUV lithography and continued reliance on 193nm
immersion technology have opened the way for technologies to supplement
inherent challenges for both. Not only is E-beam lithography gain...
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08-02-2012
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Order Focus: Singulus receives two orders for Timaris vacuum deposition system
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Singulus Technologies has won two new orders for its Timaris deposition coating machine from an unnamed source. The company expects this to be the start of a good year for shipments of such tools, as nano-coati...
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08-02-2012
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Order Focus: Veeco ships TurboDisc MOCVD tool to LG Siltron
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Veeco Instruments has revealed that it has received an order for one of its TurboDisc MOCVD tools from South Korean epi wafer manufacturer, LG Siltron. The TurboDisc tool is a K465i gallium nitride MOCVD system...
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07-02-2012
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Silicon wafer revenues climb as shipments fall
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Unlike the PV industry that has seen wafer prices decline by as much as
70% in 2011, semiconductor silicon wafer revenue actually increased by
2%, while shipments decreased 3%. Though SEMI Silicon Manufacture...
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07-02-2012
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Gigaphoton’s GT63A next-gen ArF excimer laser ready for shipment in Q2’12
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Gigaphoton has added to its immersion lithography product range with the GT63A, a next-generation ArF excimer laser for multi-patterning immersion lithography scanners. The company has announced that the new pr...
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07-02-2012
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Rudolph ships first MetaPULSE system for under-bump metallization processes
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Process characterization equipment supplier Rudolph Technologies has entered the back-end packaging sector of the semiconductor industry with its first shipment of its MetaPULSE metrology system. The shipment t...
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06-02-2012
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Steve Appleton killed in plane crash
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Friday, February 3rd, Micron Technology issued a short statement
announcing Chairman and CEO, Steve Appleton had been killed in a light
aircraft crash near Boise, Idaho. Mr Appleton was married with chidren...
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